[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"nav-product-categories":3,"site-config-honor":44,"site-config-partners":50,"site-config-milestone":61},[4,14,20,26,32,38],{"categoryId":5,"categoryCode":6,"categoryName":7,"description":8,"icon":9,"iconUrl":9,"sortOrder":10,"status":11,"remark":12,"createTime":13},"2064000000000001001","robot-amr","移动机器人","面向仓储、制造和园区场景的 AMR\u002FAGV\u002F叉车产品线，支持柔性搬运与多机协同。",null,10,"0","模拟数据","2026-08-17 01:38:08",{"categoryId":15,"categoryCode":16,"categoryName":17,"description":18,"icon":9,"iconUrl":9,"sortOrder":19,"status":11,"remark":12,"createTime":13},"2064000000000001002","smart-terminal","智能终端","手持、平板、自助终端与语音交互设备，连接人与调度系统。",20,{"categoryId":21,"categoryCode":22,"categoryName":23,"description":24,"icon":9,"iconUrl":9,"sortOrder":25,"status":11,"remark":12,"createTime":13},"2064000000000001003","dispatch-system","调度系统","机器人调度、业务集成、数字孪生与运维管理软件平台。",30,{"categoryId":27,"categoryCode":28,"categoryName":29,"description":30,"icon":9,"iconUrl":9,"sortOrder":31,"status":11,"remark":12,"createTime":13},"2064000000000001004","vision-module","视觉感知","视觉识别、质检与安全避障模块，为设备装上眼睛。",40,{"categoryId":33,"categoryCode":34,"categoryName":35,"description":36,"icon":9,"iconUrl":9,"sortOrder":37,"status":11,"remark":12,"createTime":13},"2064000000000001005","iot-gateway","物联网网关","边缘网关与数据采集设备，打通现场设备与平台。",50,{"categoryId":39,"categoryCode":40,"categoryName":41,"description":42,"icon":9,"iconUrl":9,"sortOrder":43,"status":11,"remark":12,"createTime":13},"2064000000000001006","charging-accessory","充电与配件","自动充电桩、快换电池与对接机构等配套产品。",60,{"images":45},[46,47,48,49],"http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002F0718b1d2cbb9431e8057bb6e72631e1d.png","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002F46aa92975516460d9179f2936e944a94.png","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002F60b9c0c6cfe24bd5bb1b05e28df812e7.png","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002Fcff92275bf2d4e8ca06ce27cd06cd523.png",{"logos":51},[52,55,58],{"name":53,"img":54},"美的","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002Fbf91caab2a7a4c2999af257978fcee31.png",{"name":56,"img":57},"中兴","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002F82d46e0da0cd4d3fbac9d94b28bb5145.png",{"name":59,"img":60},"小米","http:\u002F\u002F10.145.145.1:9100\u002Fxby-website\u002F2026\u002F08\u002F17\u002F3b672676795b406d9a36e02e115f3de9.png",{"items":62},[63,72,80,89,96,103,110,118,125,131,137],{"year":64,"events":65},"2025",[66,67,68,69,70,71],"获上海市经信委颁发的\"上海市制造业单项冠军企业\"荣誉1111111111111111","推出全球首款 Android+RedCap 智能芯片平台 XY8603","推出第一代 4G 八核智能 SoC 芯片 XY8661\u002F8662 并实现量产","获上海市科学技术奖科技进步奖二等奖","第一颗 5G 智能 SoC 芯片工程流片","入选 2025 上海硬核科技企业 TOP100",{"year":73,"events":74},"2024",[75,76,77,78,79],"首次参加巴塞罗那世界移动通信大会（MWC），向全球客户推广公司产品","首款 5G RedCap 芯片 XY1903 精彩亮相展会","获\"2024 上海硬核科技企业 TOP100\"、上海市重点服务独角兽企业等荣誉","首颗 4G 智能手机芯片携手 L65A 手机首秀登陆拉丁美洲市场","获\"2023 年度上海市集成电路设计业销售前十名\"",{"year":81,"events":82},"2023",[83,84,85,86,87,88],"荣获首批\"上海市创新型企业总部\"认定","荣获\"2022 年度上海市集成电路设计业销售前十名\"","荣获中国联通泛终端 RedCap 特别贡献奖、\"中国移动物联网优秀合作伙伴\"","4G 智能手机芯片完成量产流片，5G RedCap 芯片流片成功","XY1606N 获北美主流运营商认证，顺利进入北美市场","XY1806 通过 AEC-Q100 车规级测试认证",{"year":90,"events":91},"2022",[92,93,94,95],"荣获 2022 年度中国物联网企业 100 强","被授予 OpenHarmony 生态领航贡献单位（芯片）","XY1606 荣获\"中国芯\"优秀技术创新产品、\"硬核中国芯\"最佳通讯类产品奖","XY595X 系列首批通过 Wi-Fi 联盟 Wi-Fi6 Qualified Solution 认证",{"year":97,"events":98},"2021",[99,100,101,102],"国产化攻关项目荣获上海市总工会科技创新项目三等奖","低功耗广域网 SoC 芯片 XY6601 荣获中国 IC 设计成就奖","XY6601 荣获上海设计 100+、\"中国芯\"优秀技术创新产品称号","入选工信部专精特新\"小巨人\"企业",{"year":104,"events":105},"2020",[106,107,108,109],"完成 D 和 D+ 轮融资，多家知名机构共同投资 1.64 亿美元","正式更名为\"宁波兴博元智能技术有限公司\"","推出集成度更高、功耗更低的新一代 LoRa SoC 方案","首款 5G 芯片流片",{"year":111,"events":112},"2019",[113,114,115,116,117],"收购智擎信息，布局人工智能技术","移动智能终端芯片 XY8751C 通过中国移动入库测试","Wi-Fi 芯片、多模物联网芯片量产，完成 C 轮融资，估值超 10 亿美元","LTE Cat1 射频基带一体化产品正式量产","XY1802S(L) 荣获\"中国芯\"优秀技术创新产品称号",{"year":119,"events":120},"2018",[121,122,123,124],"自研基带射频一体化技术打造的 LTE 芯片成功流片","完成 B 轮融资，募资额超 1 亿美元","推出公司首款低功耗 LoRa 芯片","第二代高集成度基带通信芯片 XY1802S 量产",{"year":126,"events":127},"2017",[128,129,130],"收购 Marvell 移动通信部门","完成 A 轮融资，阿里网络、深创投等入股，总投资额超 1 亿美元","融合 Marvell 成熟通信技术的 4G 芯片量产投片",{"year":132,"events":133},"2016",[134,135,136],"收购江苏智多芯","第一版智能手机芯片成功流片","GPS 芯片量产流片",{"year":138,"events":139},"2015",[140,141],"公司正式成立","收购 Avenue Capital、Alphean"]